Materials Testing

SSL SV offers Space Expertise in Materials and Testing

Our Material Testing Capabilities Include

  • Chemical Analysis
    • Fourier Transform Infrared Spectroscopy (FTIR)
    • Energy Dispersive Spectroscopy (EDS)
    • X-Ray Fluorescence (XRF)
  • Electrical Properties
    • Resistance and Resistivity Testing Including Surface and Volume Resistivity
    • Dielectric Breakdown
  • Electrical Tests
    • Burn-In
    • Magnetics
    • PIND
    • Screening Level
    • Temperature Cycle
    • Voltage Drop
  • Hardware Analysis
    • Constructional Analysis (CA)
    • Destructive Physical Analysis (DPA)
    • Failure Analysis (FA)
    • Scanning Electron Microscopy (SEM)
    • Optical Microscope Inspection / Photographic Documentation
  • Mechanical Tests
    • Rockwell Hardness / Durometer
    • Simultaneous Load/Strain monitoring and data analysis from multiple strain gages.
    • Instron Machines (20,000 lb) For tensile, flexure, or compression testing.
      • Common Tests Performed:
      • Tensile strength, modulus and elongation
      • Compression strength and modulus
      • Flexural strength and modulus
      • Short-beam shear strength
      • Three- and four-point beam bending
      • Tape adhesion
      • Insert pullout
      • Crimp tool certification
      • Proof load testing of flight hardware
      • Flatwise Tensile
      • Miscellaneous Pull Tests
  • Metallurgical Cross-Sectional Analysis & Micro-Hardness Testing
    • Vickers and Knoop
  • Non Destructive Tests
    • Radiographic Inspection (RT)
    • Ultrasonic Inspection (UT)
    • Bond Tester (UT)
    • Acoustic Emission (AE)
    • Dye Penetrant (PT)
  • Optical Properties Measurements
    • UV-Vis-NIR spectrophotometry
    • Near-normal Emittance
  • Physical Properties Measurements
    • Viscosity
    • Specific Gravity
    • Mass determination
  • Process Verification and Qualification
    • Component Lead Forming Tool Evaluation
    • Weld Schedules
    • Wire Bond Schedules
    • Lead Pull Testing
    • Die Shear Testing
    • Printed Circuit Board Inspection
    • Flex Cable Inspection
  • Thermal Analysis Capabilities
    • Dynamic Mechanical Analysis (DMA)
    • Differential Scanning Calorimeter (DSC)
    • Thermal-Mechanical Analysis (TMA)
    • Thermal-Gravimetric Analysis (TGA)

Responsive image

Responsive image

Responsive image

Responsive image

Responsive image

Contact Us for more info.